Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9713259 | Communication module | Hiroshi Nakamura | 2017-07-18 |
| 9560743 | Multilayer circuit substrate having core layer with through-hole | Yuichi Sugiyama, Akihiro Hoshino | 2017-01-31 |