Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9595442 | Method of forming semiconductor structure with anti-punch through structure | Tsung-Yao Wen, Jui-Yao Lai, Sai-Hooi Yeong, Yen-Ming Chen | 2017-03-14 |
YC
Yao-De Chiou
Overall (2017): #192,819 of 506,227Top 40%
1
Patents 2017