Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9753895 | Method for process variation analysis of an integrated circuit | Chin-Cheng Kuo, Kmin Hsu, Wei Hu, Wei Min Chan | 2017-09-05 |
| 9748228 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Yi-Kan Cheng | 2017-08-29 |
| 9698099 | Semiconductor structure having a plurality of conductive paths | Hui Yu Lee, Feng-Wei Kuo, Yi-Kan Cheng | 2017-07-04 |