Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842774 | Through substrate via structure for noise reduction | Ping-Hao Lin, Ching-Hua Chu, Hsiao-Chun Lee, Chi-Feng Huang | 2017-12-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842774 | Through substrate via structure for noise reduction | Ping-Hao Lin, Ching-Hua Chu, Hsiao-Chun Lee, Chi-Feng Huang | 2017-12-12 |