Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768132 | Semiconductor structure and method of forming the same | LING MEI LIN, Yung-Fa Lee | 2017-09-19 |
| 9627318 | Interconnect structure with footing region | LING MEI LIN, Yu-Pin Chang | 2017-04-18 |