Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837504 | Method of modifying capping layer in semiconductor structure | Wayne Liu, Liang-Yin Chen, Xiong-Fei Yu, Hui-Cheng Chang | 2017-12-05 |
| 9660023 | Semiconductor film with adhesion layer and method for forming the same | Chi-Ming Liao, Sheng-Po Wu, Ming-Feng Hsieh, Hongfa Luan | 2017-05-23 |