Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9796011 | Forming die with flexible blank holder | Bor-Tsuen Lin, Kuan-Yu Su, Huai Liu | 2017-10-24 |
| 9735132 | Semiconductor package | Cheng-Yi Weng | 2017-08-15 |
| 9570613 | Structure and formation method of FinFET device | Kai-Hsuan Lee, Hsiang-Ku Shen, Han-Ting Tsai, Yimin Huang | 2017-02-14 |