Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9576847 | Method for forming integrated circuit structure with thinned contact | Hsin-Ying Lin, Mei-Yun Wang, Hsien-Cheng Wang, Shih-Wen Liu, Fu-Kai Yang | 2017-02-21 |
| 9536754 | Method of forming contact structure of gate structure | Fu-Kai Yang, Mei-Yun Wang, Hsien-Cheng Wang, Shih-Wen Liu, Hsin-Ying Lin | 2017-01-03 |