Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646907 | Mold package and manufacturing method thereof | Yuki Sanada, Masayuki Takenaka, Shinya Uchibori, Tasuke Fukuda | 2017-05-09 |
| 9601442 | Half-mold type mold package | Tetsuto Yamagishi | 2017-03-21 |