Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9550264 | Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer | Yuichi Kakizono, Yoshiaki Kurosawa | 2017-01-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9550264 | Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer | Yuichi Kakizono, Yoshiaki Kurosawa | 2017-01-24 |