Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693468 | Package substrate and manufacturing method thereof | Chien-Hung Wu | 2017-06-27 |
| 9603263 | Manufacturing method of circuit substrate | Tzu-Wei Huang | 2017-03-21 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693468 | Package substrate and manufacturing method thereof | Chien-Hung Wu | 2017-06-27 |
| 9603263 | Manufacturing method of circuit substrate | Tzu-Wei Huang | 2017-03-21 |