Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679846 | Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voids | Jaehyun Lee, Sunjae Kim | 2017-06-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679846 | Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voids | Jaehyun Lee, Sunjae Kim | 2017-06-13 |