Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601462 | Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer | Won Kyoung Choi, Jae Hun Ku | 2017-03-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601462 | Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer | Won Kyoung Choi, Jae Hun Ku | 2017-03-21 |