Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773756 | Semiconductor packages including molded stacked die with terrace-like edges | Jong Won Kim, Wan Choon PARK | 2017-09-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773756 | Semiconductor packages including molded stacked die with terrace-like edges | Jong Won Kim, Wan Choon PARK | 2017-09-26 |