Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831197 | Wafer-level package with metal shielding structure and the manufacturing method thereof | TSAN-LIEN YEH, Kuan-Tien Shen, Wei Wang | 2017-11-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831197 | Wafer-level package with metal shielding structure and the manufacturing method thereof | TSAN-LIEN YEH, Kuan-Tien Shen, Wei Wang | 2017-11-28 |