Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761770 | Optoelectronic semiconductor chip encapsulated with an ALD layer and corresponding method for production | Johann Eibl, Sebastian Taeger, Lutz Höppel, Karl Engl, Stefanie Rammelsberger +3 more | 2017-09-12 |
| 9570662 | Method of encapsulating an optoelectronic device and light-emitting diode chip | Sebastian Taeger, Martin Welzel, Karl Engl | 2017-02-14 |