Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9826639 | Wiring substrate | Osamu Hoshino | 2017-11-21 |
| 9721884 | Inductor device and method of manufacturing the same | Yasuyoshi Horikawa, Tsukasa Nakanishi | 2017-08-01 |
| 9603253 | Wiring substrate, manufacturing method therefor, and semiconductor package | Toshio Kobayashi, Yasuyoshi Horikawa, Hiroshi Shimizu | 2017-03-21 |