Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799595 | Careless wiring substrate having an insulation layer with a bulged covering portion and semiconductor device thereof | Hiroshi Tomizawa | 2017-10-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799595 | Careless wiring substrate having an insulation layer with a bulged covering portion and semiconductor device thereof | Hiroshi Tomizawa | 2017-10-24 |