Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9576927 | Bonding tool cooling apparatus and method for cooling bonding tool | Osamu Kakutani, Takatoshi Kawamura, Akira Sato | 2017-02-21 |
| 9536856 | Flip chip bonder and flip chip bonding method | — | 2017-01-03 |