Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9775237 | Wiring substrate and method for manufacturing the same | — | 2017-09-26 |
| 9704828 | Semiconductor module | Yuji Morinaga, Osamu Matsuzaki | 2017-07-11 |
| 9669573 | Injection molding apparatus and injection molding method | Toshihiko Kariya, Naoki Toda, Munehiro Nobuta, Kiyoshi Kinoshita, Takeshi Yamaguchi +4 more | 2017-06-06 |
| 9538642 | Wiring board and method for manufacturing the same | — | 2017-01-03 |