Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711378 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device | Kazuaki Sumita, Tatsuya Uehara | 2017-07-18 |
| 9633921 | Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition | Shoichi Osada, Ryuhei Yokota | 2017-04-25 |