Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9670362 | Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom | Yundong Meng | 2017-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9670362 | Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom | Yundong Meng | 2017-06-06 |