MU

Minoru Ueshima

SC Senju Metal Industry Co.: 2 patents #9 of 53Top 20%
OU Osaka University: 1 patents #31 of 199Top 20%
Overall (2017): #121,584 of 506,227Top 25%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9807889 Method of mounting electronic component to circuit board Kozo Fujimoto, Shinji Fukumoto, Michiya Matsushima, Satoshi Watanabe, Takeshi Kan +2 more 2017-10-31
9796053 High-temperature lead-free solder alloy Rei Fujimaki 2017-10-24