Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837287 | Sealing structure for a bonded wafer and method of forming the sealing structure | Yuankun Hou, Yu Hua, Yuelin Zhao | 2017-12-05 |
| 9653312 | Sealing structure for a bonded wafer and method of forming the sealing structure | Yuankun Hou, Yu Hua, Yuelin Zhao | 2017-05-16 |