Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847355 | Silicon nitride film, and semiconductor device | Shunpei Yamazaki, Kengo Akimoto | 2017-12-19 |
| 9842994 | Peeling method and method of manufacturing semiconductor device | Junya Maruyama, Shunpei Yamazaki | 2017-12-12 |
| 9818978 | Light emitting device | Shunpei Yamazaki | 2017-11-14 |
| 9777352 | Oil-well steel pipe having excellent sulfide stress cracking resistance | Atsushi Soma, Tomohiko Omura, Yuji Arai, Mitsuhiro Numata, Masanao Seo | 2017-10-03 |
| 9768405 | Light emitting device and method of manufacturing the same | Hirokazu Yamagata, Shunpei Yamazaki | 2017-09-19 |
| 9755148 | Peeling method and method of manufacturing semiconductor device | Junya Maruyama, Shunpei Yamazaki | 2017-09-05 |
| 9660159 | Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof | Keiji Sato, Shunpei Yamazaki | 2017-05-23 |
| 9640778 | Semiconductor device and method for manufacturing the same | Junya Maruyama, Yumiko Ohno | 2017-05-02 |
| 9620408 | Semiconductor device and method of manufacturing the same | Junya Maruyama, Yuugo Goto | 2017-04-11 |
| 9608004 | Semiconductor device and peeling off method and method of manufacturing semiconductor device | Junya Maruyama, Mayumi Mizukami, Shunpei Yamazaki | 2017-03-28 |
| 9543337 | Semiconductor device and manufacturing method thereof, delamination method, and transferring method | Junya Maruyama, Yumiko Ohno, Shunpei Yamazaki | 2017-01-10 |
| 9536901 | Method for fabricating a semiconductor device by bonding a layer to a support with curvature | Shunpei Yamazaki, Masakazu Murakami, Junya Maruyama | 2017-01-03 |