Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773820 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Tomoaki Moriwaka, Shinya Sasagawa | 2017-09-26 |
| 9722056 | Method for manufacturing semiconductor device | Shunpei Yamazaki, Akihisa Shimomura, Yasumasa YAMANE, Yuhei Sato, Tetsuhiro Tanaka +6 more | 2017-08-01 |