Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847249 | Buried etch stop layer for damascene bit line formation | Yuji Takahashi, Takuya Futase, Katsuo Yamada, Tomoyasu Kakegawa | 2017-12-19 |
| 9799527 | Double trench isolation | Katsuo Yamada, Yuji Takahashi, Takuya Futase, Tomoyasu Kakegawa | 2017-10-24 |
| 9768183 | Source line formation and structure | Shunsuke Akimoto, Hidetoshi Nakamoto, Keita Kumamoto, Hidehito Koseki, Yuji Takahashi +2 more | 2017-09-19 |
| 9666479 | Patterning method for low-k inter-metal dielectrics and associated semiconductor device | — | 2017-05-30 |
| 9607997 | Metal line with increased inter-metal breakdown voltage | Katsuo Yamada, Yuji Takahashi, Masami Uozaki, Kiyokazu Shishido, Takuya Futase +1 more | 2017-03-28 |