Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9732183 | Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board | Yukihiro USUI, Kazuya Takahashi | 2017-08-15 |
| 9565754 | Solder-mounted board, production method therefor, and semiconductor device | — | 2017-02-07 |