Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780071 | Stacked semiconductor package including reconfigurable package units | Sang Eun Lee, Eun Ko | 2017-10-03 |
| 9711482 | Semiconductor package embedded with plurality of chips and method of manufacturing the same | Sang Eun Lee, Eun Ko | 2017-07-18 |