Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673120 | Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same | Sang Jin Kim, Eun Jung Lee | 2017-06-06 |
YC
Yong Han CHO
Overall (2017): #188,300 of 506,227Top 40%
1
Patents 2017