SS

Seung Dae Seok

SC Semes Co.: 1 patents #3 of 35Top 9%
Samsung: 1 patents #6,542 of 15,326Top 45%
Overall (2017): #247,743 of 506,227Top 50%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9620476 Bonding head and die bonding apparatus having the same Hang Lim LEE, Jong Jin Weon, Soon Hyun KIM 2017-04-11