Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9789584 | Buffing expanded foam items | Patrick Conall Regan, Dong Woo Lee, Dong Youp Yang, Byung Gi Kim, Yong-Joo Chon +1 more | 2017-10-17 |
| 9748154 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, In Bae Park, Sang Won Kim +1 more | 2017-08-29 |