Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786644 | Methods of fabricating a semiconductor package | Hongbin Shi, Hojeong Moon | 2017-10-10 |
| 9728516 | Electric apparatus including electric patterns for suppressing solder bridges | Hongbin Shi | 2017-08-08 |
| 9698088 | Semiconductor packages | Heungkyu Kwon, Jaewook Yoo, Su-chang Lee | 2017-07-04 |