Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761563 | Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same | — | 2017-09-12 |
HE
Hyung-Lae Eun
Overall (2017): #395,926 of 506,227Top 80%
1
Patents 2017