Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9839127 | System of package (SoP) module and mobile computing device having the SoP | Kyoung-Mook Lim | 2017-12-05 |
| 9811122 | Package on packages and mobile computing devices having the same | — | 2017-11-07 |
| 9665122 | Semiconductor device having markings and package on package including the same | Hae-Gu Lee, Byeong-Yeon Cho | 2017-05-30 |
| 9640499 | Semiconductor chip, flip chip package and wafer level package including the same | — | 2017-05-02 |
| 9601458 | Stacked semiconductor package including connections electrically connecting first and second semiconductor packages | Su-chang Lee | 2017-03-21 |