Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773699 | Methods of forming wiring structures including a plurality of metal layers | Jong Jin Lee, Rak-Hwan Kim, Byung-Hee Kim, Jin-Nam Kim, Tsukasa Matsuda +6 more | 2017-09-26 |
| 9728604 | Semiconductor devices | Jin-Nam Kim, Rak-Hwan Kim, Byung-Hee Kim, Jong-Min Baek, Sang-Hoon Ahn +3 more | 2017-08-08 |