Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805769 | Semiconductor device having interconnection in package and method for manufacturing the same | Jaehyung Lee, Jungsik Kim, Youngdae Lee, Sungmin Yim, Kwangil Park +1 more | 2017-10-31 |