Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601466 | Semiconductor package and method of manufacturing the same | Jeongwon Yoon, Baikwoo Lee, Hyunsuk Chun | 2017-03-21 |
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Boin Noh
Overall (2017): #476,909 of 506,227Top 95%
1
Patents 2017