Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824997 | Die package with low electromagnetic interference interconnection | Eric A. Sanjuan | 2017-11-21 |
| 9812420 | Die packaging with fully or partially fused dielectric leads | Eric A. Sanjuan | 2017-11-07 |
| 9711479 | Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same | Eric A. Sanjuan | 2017-07-18 |
| 9673137 | Electronic device having a lead with selectively modified electrical properties | Eric A. Sanjuan | 2017-06-06 |