Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831204 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2017-11-28 |
| 9761463 | Semiconductor device and semiconductor device manufacturing method | Takamitsu Yoshida, Kuniaki Utsumi, Atsuko Kawasaki | 2017-09-12 |
| 9721865 | Semiconductor device with a semiconductor chip connected in a flip chip manner | Osamu Miyata | 2017-08-01 |
| 9679867 | Semiconductor device having a low-adhesive bond substrate pair | Hiroaki ASHIDATE | 2017-06-13 |