Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9536859 | Semiconductor device packaging having plurality of wires bonding to a leadframe | — | 2017-01-03 |
HK
Hiroyuki Kaneda
Overall (2017): #402,650 of 506,227Top 80%
1
Patents 2017