Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809883 | Formaldehyde free electroless copper plating compositions and methods | Andy Lok-Fung Chow, Dennis Kwok-Wai Yee | 2017-11-07 |
| 9702046 | Electroless copper plating compositions | David S. Laitar, Andy Lok-Fung Chow | 2017-07-11 |
| 9611550 | Formaldehyde free electroless copper plating compositions and methods | Andy Lok-Fung Chow, Dennis Kwok-Wai Yee | 2017-04-04 |