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James D. Sampica

Rockwell Collins: 2 patents #42 of 321Top 15%
📍 Springville, IA: #1 of 4 inventorsTop 25%
🗺 Iowa: #245 of 1,748 inventorsTop 15%
Overall (2017): #143,337 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9638944 Systems and methods for substrate lamination Cameron T. McCalley, Brian K. Smith 2017-05-02
9573327 Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen 2017-02-21