Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831381 | Package substrate machining method | — | 2017-11-28 |
| 9799396 | Semiconductor device | Shinji Tanaka, Makoto Yabuuchi | 2017-10-24 |
| 9542999 | Semiconductor device | Shinji Tanaka, Makoto Yabuuchi | 2017-01-10 |