Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583502 | Method of manufacturing a semiconductor device | Hiroshi Nishikizawa, Hiraku Chakihara, Mitsuhiro Noguchi | 2017-02-28 |
| 9536821 | Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same | Katsuhiko Hotta, Takashi Moriyama | 2017-01-03 |