Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666562 | 3D integrated circuit | Oscar Ming Kin Law, Chunchen Liu | 2017-05-30 |
| 9608602 | Uncertainty aware interconnect design to improve circuit performance and/or yield | Chunchen Liu, Oscar Ming Kin Law, Po-Hung Chen, Zhengyu Duan | 2017-03-28 |