Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9789569 | Solder material and bonded structure | Akio Furusawa, Kiyohiro Hine, Masato Mori | 2017-10-17 |
| 9707737 | Composite material and electronic apparatus | Shigeaki Sakatani | 2017-07-18 |
| 9638469 | Condenser, multistage pressure condenser provided therewith, and reheating module used in condenser | Issaku Fujita, Satoshi Hiraoka, Kenji Kirihara, Akira Fukui, Kensuke Nishiura | 2017-05-02 |