Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9775239 | Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board | Tatsuya Arisawa, Yoshihiko Nakamura, Tomoyuki Abe, Syouji Hasimoto, Mitsuyoshi Nishino | 2017-09-26 |
| 9730320 | Prepreg, laminate, metal foil-clad laminate, circuit board and LED module | Takashi Matsuda, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi +2 more | 2017-08-08 |
| 9718941 | Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board | Takashi Matsuda, Mitsuyoshi Nishino | 2017-08-01 |