Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825209 | Electronic component package and method for manufacturing the same | Seiichi Nakatani, Yoshihisa Yamashita, Koji Kawakita, Susumu Sawada | 2017-11-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825209 | Electronic component package and method for manufacturing the same | Seiichi Nakatani, Yoshihisa Yamashita, Koji Kawakita, Susumu Sawada | 2017-11-21 |