Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780063 | Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer | JoonYoung Choi, SungWon Cho | 2017-10-03 |
| 9733752 | Mobile terminal and control method thereof | Jongseok Park, Jaeyoung JI, Younghoon Lee, Byoungzoo JEONG, Nayeoung Kim +5 more | 2017-08-15 |